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InTech-2000 電鍍純銦
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詳細信息(InTech-2000 電鍍純銦)
  • 產(chǎn)品名稱: InTech-2000 電鍍純銦
  • 用途: 專為在廣泛的電流密度下快速沉積純銦而設(shè)計
  • 化學(xué)名: InTech-2000
產(chǎn)品參數(shù)
產(chǎn)品名稱:InTech-2000 電鍍純銦 用途:專為在廣泛的電流密度下快速沉積純銦而設(shè)計 化學(xué)名:InTech-2000
產(chǎn)品特點

InTech-2000 High Speed, Reel to Reel, Pure Indium The InTech -2000 is a high-speed, high efficiency, stable electroplating system designed for the rapid deiti of pure indium at a wide range of current densities. M-Ctact InTech-2000 offers the advantage of being a pure indium, lead-free, plating process providing an ultra-soft deit that yields a uniform grain size, which is an excellent alternative to reduce the tendency for whisker growth. The process results in uniform, matte white deits over a very wide cathode current density range. The resulting deits he excellent reflow properties and are great for press fit applicatis. InTech -2000是一種高速、、穩(wěn)定的電鍍系統(tǒng),專為在廣泛的電流密度下快速沉積純銦而設(shè)計。 InTech -2000具有純銦無鉛電鍍工藝的優(yōu)勢,提供超軟鍍層,產(chǎn)生均勻的晶粒尺寸,這是減少晶須生長趨勢的選擇。該工藝在極寬的陰極電流密度范圍內(nèi)產(chǎn)生均勻的啞光白色沉積 物。所得到的沉積物具有優(yōu)異的回流性能,對壓濾效果很好。 READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT 在使用本產(chǎn)品之前,請閱讀完整的技術(shù)說明書 Features 特性 Benefits 優(yōu)點 Operates over a wide current density range 在寬電流密度范圍內(nèi)工作 Uniform plating thickness regardless of part geometry 鍍層厚度均勻,不考慮零件幾何形狀 Analyzable additives 可分析的添加劑 Easy to maintain and cool 易于維護和控制 Simplified effluent treatment 簡化污水處理 Envirmentally friendly process 環(huán)保工藝 High efficiency 效率高 Csistent plating rate throughout the life of the bath 在鍍液的整個使用壽命中保持一致的鍍速 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 PROCESS COMPONENTS REQUIRED 所需的工藝組件 InTech -METAL(Cceate: 300 g/L) MSA Acid (MSA: 950 g/L) InTech -2000 A IN-METAL(濃縮:300 g/L) MSA酸(MSA: 950 g/L) InTech 2000 Chemicals/Products Required 化學(xué)物質(zhì)/產(chǎn)品要求 Optimum InTech -METAL 167 mL/L MSA Acid 60 mL/L InTech -2000 A 50 mL/L Deiized Water 724 mL/L 1.Add 500 mL/L Deiized water to tank. 2.Add MSA Acid and allow to mix thoroughly. 3.Add InTech -METAL and allow to mix thoroughly. 4.Add InTech -2000 A and allow to mix thoroughly. 5.Bring soluti level up to final volume with Deiized water. 1.向罐中加入500ml /L去離子水。 2.加入MSA酸,充分混合。 3.加入InTech -METAL,充分混合。 4.加入InTech - 2000a,充分混合。 5.用去離子水使溶液達到最終體積。 We recommend a 10% soluti of MSA Acid as an activati step to remove mild oxides and help prevent drag-in of cinants into the InTech -2000 plating bath. 我們建議使用10%的MSA酸溶液作為活化步驟,以去除溫和的氧化物,并有助于防止污染物進入InTech - 2000鍍槽。 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 EQUIPMENT 設(shè)備 Anodes 陽極 Indium slabs, balls, or chunks, in titanium anode baskets must be kept full to ensure proper corrosi of the anodes. Baskets should be bagged. 鈦陽極籃中的銦板、銦球或銦塊必須保持滿溢,以確保陽極的適當腐蝕。籃子應(yīng)該裝上袋子。 Tanks 罐 Polypropylene, polyethylene, PVDC, or rubber-lined tanks 聚丙烯,聚乙烯,PVDC,或橡膠內(nèi)襯罐 Pumps 泵 Polypropylene, PVC or PVDC 聚丙烯,PVC或PVDC Filtrati 過濾 5 to 30 micr Dynel or polypropylene cartridge with 4 to 5 turnovers per hour. Ctinuous filtrati is recommended to remove any particulate matter which may fall into the bath. Care should be taken to exclude the eance of air into the filtrati system to minimize foaming. 5至30微米的戴奈爾或聚丙烯墨盒,每小時4至5次周轉(zhuǎn)。建議進行連續(xù)過濾,以去除可能落入槽內(nèi) 的任何顆粒物質(zhì)。應(yīng)注意防止空氣進入過濾系統(tǒng),以盡量減少起泡。 Heaters 加熱器 PTFE, titanium, stainless steel, or silica-sheathed 聚四氟乙烯,鈦,不銹鋼或硅護套 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 Equipment Pretreatment: 設(shè) 備 預(yù) 處 理 : Solutis Required: 方案要求: Trisodium Phosphate 三鈉 Sodium Hydroxide 氫 MSA Acid MSA 酸 15 g/L (2 oz/gal) 15 g/L (2 oz/gal) 10% v/v (100 mL/L Whenever a new plating line is set up, or an old line cverted to a different chemistry, it is advisable to first thoroughly clean and leach all existing equipment: 每當建立新的電鍍生產(chǎn)線,或舊生產(chǎn)線轉(zhuǎn)換為不同的化學(xué),建議首先清潔和浸出所有現(xiàn)有設(shè)備: 1.Thoroughly wash all tanks and equipment with deiized water. Discard the water. 2.Fill the tanks with a cleaning soluti of 15 g/L (2 oz/gal) trisodium phosphate and 15 g/L (2 oz/gal) sodium hydroxide. Warm to 140 °F and recirculate it for four (4) hours through the system. Discard the soluti. 3.Fill the system with deiized water. Recirculate it for two (2) hours through the system, then discard the water. 4.Add a leaching soluti of 10 % MSA Acid to the system. Recirculate for eight (8) hours, then discard the leaching soluti. 5.Fill the system again with deiized water. Recirculate it for e (1) hour through the system, and then discard the water. 1.用去離子水清洗所有水箱和設(shè)備。把水倒掉。 2.用15g /L (2 oz/gal)三鈉和15g /L (2 oz/gal)氫的清潔溶液填充槽。加熱至140°F,通過系統(tǒng)循環(huán)四(4)小時。丟棄解決方案。 3.向系統(tǒng)中注入去離子水。通過系統(tǒng)再循環(huán)兩(2)小時,然后丟棄水。 4.在系統(tǒng)中加入10% MSA酸的浸出液。再循環(huán)八(8)小時,然后丟棄浸出液。 5.再次向系統(tǒng)中注入去離子劑 Chemicals/Products Required 化學(xué)物質(zhì)/產(chǎn)品要求 Range 范圍 Optimum Indium (III) Metal 金屬銦(III) 40 to 60 g/L 50 g/L Free Methane Sulfic Acid 47 to 67g/L 57 g/L InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 游離甲烷磺酸 InTech -2000 A InTech 2000 40 to 60 mL/L 50 mL/L Temperature 溫度 40 to 60 °C (105 to140 °F) 50 °C (122 °F) Agitati 攪 動 Very High, Overflow, Recirculati Cathode Current Density 陰極電流密度 5 to 60 ASD (50 to 600 ASF) Dependant equipment design and producti requirements Anode to Cathode Ratio1 負極比 1:1 to 6:1 Deiti Rate 沉積速率 2 to 3 ?m/min @ 10 ASD by “Hull cell panel plating” InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 Generic process cycle is shown below 一般流程周期如下所示 1.Cathodic Electro-cleaning 2.DI Water rinse 3.Micro-etching 4.DI water rinse 5.Nickel plating 6.DI water rinse 7.10% MSA pre-dip for 10 to 20 secds 8.Indium plating 9.DI water rinse 10.t-dip/Neutralized (15 to 20 g/L Trisodium Phosphate) 11.DI water rinse 12.Dry and package 1.陰極Electro-cleaning 2.去離子水沖洗 3.Micro-etching 4.去離子水沖洗 5.鍍鎳 6.去離子水沖洗 7. 10% MSA預(yù)浸10 - 20秒 8.鍍銦 9.去離子水沖洗 10.浸后/中和(15 - 20g /L三鈉) 11.去離子水沖洗 12.干燥和包裝 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 SOLUTION MAINTAINANCE 解決方案和維護 As a general guideline, 300 to 400 mL/1000 Amp-hours of InTech -2000 A may be used. The additive cceati in the bath can also be mitored by UV-Visible Spectrophotometry (see attached procedure). Actual replenishment rates will vary up part design, drag-out, plating equipment and operati parameters. 作為一般指南,可使用300至400 mL/1000安培小時的M-接觸器IN-2000 A。 浴液中的添加劑濃度也可以通過紫外-可見分光光度法進行監(jiān)測(見所附程序)。實際補充率將因零件設(shè)計、拉伸、電鍍設(shè)備和操作參數(shù)而變化。 Periodic analysis and maintenance of the bath compents is essential to obtaining optimum performance. Frequency of analysis depends bath throughput. Ensure that the bath is at operating volume and temperature, and thoroughly mixed before sampling. 定期分析和維護鍍液組件是獲得性能的必要條件。分析頻率取決于浴槽吞吐量。取樣前,確保液浴 處于工作體積和溫度,并充分混合。 Analysis of Indium by Titrati Method 滴定法分析銦Required Reagents 所需試劑 1N NaOH Glacial acetic acid 0.0575 M Disodium EDTA standard soluti 0. 1% PAN indicator 1N氫 冰醋酸 0.0575 M EDTA二鈉標準溶液 0.1% PAN指示器 1.Pipette 1 mL working soluti, put in 250 mL Erlenmeyer flask, add about 100 mL DI water and mix well 2.Neutralize soluti with 1N NaOH (~2 mL) and soluti will turn white turbid 3.Add about 3 mL of glacial acetic acid to dissolve the turbidity and the soluti will turn back clear 4.Add 5 drops of PAN indicator and the soluti will turn red 5.Titrate with 0.0575 M Disodium EDTA soluti from red to yellow end point, record the volume (V in mL) of EDTA soluti titrated 1.移液1 mL,放入250 mL的Erlenmeyer燒瓶中,加入約100 mL的去水,混合均勻 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 2.用1N NaOH (~ 2ml)中和溶液,溶液變成白色渾濁3.加入約3ml冰醋酸溶解渾濁,溶液變清 4.加入5滴PAN指示劑,溶液變紅 5.用0.0575 M EDTA溶液從紅色終點滴定至黃色終點,記錄所滴定EDTA溶液的體積(V, mL) Calculatis 計算 Indium metal ctent (g/L) = V x 5.75 (g/L) 金屬銦含量(g/L) = V × 5.75 (g/L) Analysis of Indium Metal by Inductively Coupled Plasma (ICP) 電感耦合等離子體(ICP)分析金屬銦 Required Reagents 所需試劑 1.Nitric Acid Soluti (5%) – prepared by diluting an accurately measured volume of cceated nitric acid with a known volume of deiized water. 1.溶液(5%)-通過稀釋測量體積的 濃和已知體積的去離子水。 2.Indium Standard Stock Soluti (10,000 mg/L) 2.銦標準原液(10,000 mg/L) 3.Indium Calibrati Standards – 0.0 ppm, 100 ppm, 200 ppm, 300 ppm and 400 ppm; prepared by pipetting an accurately measured volume of indium standard stock soluti (10,000 mg/L) into a 10 ml volumetric flask and diluting to the mark with deiized water. Note: the calibrati curve range may be adjusted depending the estimated amount of indium in the prepared sample. 3.銦校準標準- 0.0 ppm, 100ppm, 200ppm, 300ppm和400ppm; 通過移液測量體積的銦標準原液制備 (10,000 mg/L)放入10ml容量瓶中,用去離子水稀釋至標記。 注:校正曲線范圍可根據(jù)預(yù)估量進行調(diào)整 制備樣品中的銦。 Analysis Procedure 分析過程 1.The Indium (In) signal is detected at the 303.936 {111} (Radial) welength. 1. 銦(In)信號在303.936{111}(徑向)波長被檢測到。 2.Quantitati of indium is accomplished by fitting the signal counts of Indium to that of a calibrati curve. 2.銦的定量是通過將銦的信號計數(shù)擬合到a的信號計數(shù)來完成的 校準曲線。 3.Aspirate indium calibrati standards directly into the plasma. Record counts for indium using the welength 303.936 {111} (Radial). Repeat reg three times and erage the results. 3.將銦校準標準品直接吸入血漿中。銦的記錄計數(shù) 使用波長303.936{111}(徑向)。重復(fù)閱讀三次,取平均數(shù) 結(jié)果。 4.Create a calibrati curve for indium by plotting intensity (counts) vs. indium cceati. 4.通過繪制強度(計數(shù))與銦濃度的關(guān)系,創(chuàng)建銦的校準曲線。 5.Transfer 1.0 ml of makeup bath soluti into a 200 ml volumetric flask and dilute to the mark with 5% nitric acid soluti (200 times diluti). 5.將1.0 ml化妝浴液轉(zhuǎn)移到一個200 ml的容量瓶中,稀釋到 用5%溶液(稀釋200倍)標記。 6.Aspirate the diluted makeup bath soluti directly into the plasma. Record counts for indium using the welength 303.936 {111} (Radial). Repeat reg three times and erage the results. 6. 將稀釋的化妝浴液直接吸入血漿中。使用波長303.936{111}(徑向)記錄銦的計數(shù)。重復(fù)閱讀三次,取平均值。 Calculatis 計算 Calculate the indium cceati in the makeup bath soluti as follows: 計算化妝浴液中銦的濃度如下: [In] (mg/L) = (? canpSe–B)x DF n where A sample is the indium counts of the diluted makeup bath sample soluti, M is the slope calculated from the calibrati curve, B is the y-intercept calculated from the calibrati curve, and DF is the diluti factor (200) 式中A樣品為稀釋后的化妝浴樣品溶液的銦計數(shù), M為標定曲線計算的斜率, B為標定曲線計算出的y軸截距 DF為稀釋系數(shù)(200) A nalysis of Free Acid 游 離 酸 分 析 Required Reagents 所需試劑 4% Ammium Oxalate 1.0 N NaOH Methyl Red indicator 4%銨 1.0 N NaOH 紅色指示器 1.Pipet a 5 mL sample of the plating bath into a 250 mL Erlenmeyer flask. 2.Add 100 mL of 4 % Ammium Oxalate soluti to the flask and mix well. 3.Add 20 drops of Methyl Red indicator soluti. 4.Titrate with 1.0 N NaOH to a yellow endpoint. Beyd the endpoint, the soluti becomes turbid 1.用移液管將5ml的鍍液樣品移入250ml的Erlenmeyer燒瓶中。 2.在燒瓶中加入100毫升4%銨溶液,混合均勻。 3..加入20滴紅指示劑溶液。 4.用1.0 N NaOH滴定至黃色終點。在端點之外,解決方案變成 渾濁的 Calculatis 計算 MSA free acid (g/L) = (mL, 1.0 N NaOH) x (14.5) MSA(g/L) = (mL, 1.0 N NaOH) x (14.5) S pectrophotometric analysis InTech -2000 A 分 光 光 度 分 析 InTech -2000 Required Reagents/Materials 所需試劑/材料 UV-Visible Spectrophotometer 1.0 cm-quartz or disable-methacrylate cuvettes for UV-Visible 紫外可見分光光度計 1.0厘米石英或一次性丙烯酸酯比色皿用于紫外可見 Soluti Preparati 解決方案準備 1.Use DI water as blank soluti 2.Sample bath 2. 樣本浴 Dilute the make-up bath 10x by pipetting 5 mL of the plating bath and put in 50 mL volumetric flask. Top with DI water to mark and mix well. 用移液法將5 mL電鍍液稀釋10倍,加入50 mL 容量瓶。在上面加入去離子水標記并混合均勻。 Measurements 測 量 Measure the absorbance of the filtered sample soluti at 286.0 nm, using the DI water as a reference. 在286.0 nm處測量過濾后的樣品溶液的吸光度,以去離子水作為吸光度 參考。Calculate the cceati of InTech -2000 A (ml/L) using the following equati: 使用以下公式計算InTech -2000 A的濃度(ml/L): M-Ctact IN-2000 A (ml/L) = Absorbance 0.0057 It is recommended that the company/operator read and review the Safety Data Sheets for the appropriate health and safety warnings before use. 建議公司/操作人員閱讀和審查安全數(shù)據(jù)表 使用前適當?shù)慕】岛桶踩妗? Safety Data Sheets are ailable. 安全數(shù)據(jù)表可用。 Prior to using any recommendatis or suggestis for waste treatment, the user is required to know the appropriate local/state/federal regulatis for -site or off-site treatment which may require permits. If there is any cflict regarding our recommendatis, local/state/federal regulatis take precedent. 在使用任何有關(guān)廢物處理的建議或建議之前,用戶必須 了解當?shù)?州/聯(lián)邦對現(xiàn)場或非現(xiàn)場處理的適當規(guī)定 需要許可。如果我們的建議有任何沖突,地方/州/聯(lián)邦 法規(guī)有先例可循。 InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 Product 產(chǎn)品 InTech -METAL M-Ctact 金屬 MSA Acid MSA 酸 InTech -2000A InTech -2000A Product codes are in 5 gall package sizes. Please ctact your Customer Service Representative for additial package sizes. 產(chǎn)品代碼是在5加侖包裝尺寸。請與您的客戶服務(wù)聯(lián)系 額外包裝尺寸的代表。 To cfirm this document is the most recent versi, please ctact altchem@aliyun.com www.zhgdukj.com 要確認此文件是版本,請聯(lián)系altchem@aliyun.com www.zhgdukj.com Also read carefully warning and safety informati the Safety Data Sheet. This data sheet ctains technical informati required for safe and ecomical operati of this product. READ IT THOROUGHLY PRIOR TO PRODUCT USE. 同時仔細閱讀安全數(shù)據(jù)表上的警告和安全信息。本數(shù)據(jù)表包含本產(chǎn)品安全、經(jīng)濟運行所需的技術(shù)信息。使用產(chǎn)品前 請仔細閱讀。 DISCLAIMER: All statements, technical informati and recommendatis ctained herein are based tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No statement or recommendati shall cstitute a representati unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligati of seller and manufacturer under this warranty shall be to replace any ncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct, indirect, incidental or csequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in respse to a customer request that specifies operating parameters beyd those stated above, or if products are used under cditis exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect, incidental and csequential damages that may result from use of the products under such cditis, and agrees to exerate, indemnify, defend and hold harmless MacDermid, Incorporated and its affiliates therefrom. No suggesti for product use nor anything ctained herein shall be cstrued as a recommendati to use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no respsibility or liability for any such infringement. InTech-2000 電鍍純銦 Versi: 01 Doc.-No.: 201801-001 免責聲明:本文中包含的所有陳述、技術(shù)信息和建議均基于我們認為可靠的測試,但不保證其準確性或完整性。除 非在賣方和制造商官員簽署的協(xié)議中規(guī)定,否則任何陳述或建議均不構(gòu)成陳述。無 作出適銷性、適用于特定用途的保證或任何默示保證。以下保證代替上述保證和所有其他明示、暗示或法定的保證。產(chǎn)品保證是免費的

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