單片機回收

    ◆現(xiàn)金◆上門◆  13631665055 肖先生
★A、大量廠家?guī)齑嬉约皞€人積壓電子料，各種手機IC，字庫、 CPU、電池。 
★B、各種家電、通訊、網(wǎng)絡、電源IC、集成塊，各種工業(yè)模塊等，發(fā)光管、
接收頭、開關、電位器、咪頭、晶振。 
★C、二、三極管、大小功率管、場效應管、可控硅、三端穩(wěn)壓、整流橋、
光耦、繼電器、變壓器，鉭電容、電感、磁珠、電解電容。
★D、內存蕊片、存儲器、K9K、K9F、K4Shy等、單面機、PIC、12F、16F、
18F、24C系列，電腦配件、硬盤、內存條、BGA（南北橋）、蕊片、顯卡。 
★E、mp3、mp4、數(shù)碼相機等各種配件，蕊片、收音模塊、主控IC、字庫、
顯存、CPU、排線、電池、各類攝像頭等成品 銘盛電子回收電子元器件
       聯(lián)系電話  13631665055 肖先生 QQ 1073735185

E-mail   shuyun131421@163.com   

前端模塊,Diversity Front End Module,For EU : Band1/3/5/7/8/20,26 Pin,4.7×3.9×1.0 mm,N/A,HFQSWEJUA-136,MURATA
平臺主芯片,Mobile Station Modem,576 NSP,576.0 Balls,11×11×1.05 mm,0.40 mm,Non-Security,N/A,MSM-7627A-0-576NSP-MT-01-0,QUALCOMM
WIFI/Bluetooth芯片,WLAN+BT chip,WLAN IEEE 802.11b/g/n,60pin,8.2×7.3×1.25 mm,N/A,Security,Broadcom BCM4329 WLAN+BT,WBB23BOKR05,SAMSUNG
前端集成模塊,WLAN/BT FEM,802.11b/g/n WLAN/BT FEM,16pin,3.0×3.0×0.45 mm,N/A,TQM679002,TRIQUINT
集成電路,3V TD-SCDMA/W-CDMA LINEAR,3×3×1.0mm,10pin,N/A,RF7234,RFMD
射頻開關,SPDT Switch,1.5×1.5mm,MLPD 6-pin,N/A,SKY13319-374LF,SKYWORKS
四工器,Quadplexer,PCS and Cellular band,Cellular/PCS lexer Rx&Tx,3×5×1.05mm,N/A,N/A,ACFM-7110-TR1,AGO
負載開關,Log Switch,3.1×3.0mm,SOT23-5,500mA,LPW5206B5F,LOWPOWER
天線開關模塊,Antenna Switch Module,SP8T,2.85- 4.7 V,PG-VCCN-20-1(3.2×2.8×1mm),2GSM Tx and 6WCDMA-TRx,BGSF18DM20,INFINEON
模擬開關,DPDT AN/Alog Switch,1.8×1.4mm,UTQFN 10L,N/A,SGM7227YUWQ10G/TR,SGMICRO
模擬開關,SPDT AN/Alog Switch,2×2mm,QFN, 6-pin,N/A,RF1200,RFMD
穩(wěn)壓器,LDO,N/A,SOT-23-5,2.8V,150mA,RP119N281D-TR-FE,RICOH
電壓調節(jié)器,LDO,N/A,SOT-23-5,1.8V,150mA,RP119N181D-TR-FE,RICOH
穩(wěn)壓器,LDO,1.0×1.0mm,PLP1010-4,3.0V,150mA,RP103K301D-TR,RICOH
雙路穩(wěn)壓器,Dual LDO,3.02×2.95mm,TSOT-23-6L,250mA,1.2V/1.8V,SGM2027-AAYTN6G/TR,SGMICRO
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,3.0V,500mA,RT9013-30GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,2.5V,500mA,RT9013-25GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,500mA,1.2V,RT9013-12GB,RICHTEK
穩(wěn)壓器,LDO,3.1×3.0mm,SOT-25,500mA,3.3V,RT9167A-33GB,RICHTEK
穩(wěn)壓器,LDO,2.9×2.8mm,SOT-23-5,2.8V,500mA,RT9013-28GB,RICHTEK
無線收發(fā)芯片,EDGE/HSPA+ Transceiver IC,PG-WFWLB-138-2,5×5.3×0.8mm,0.40 mm,N/A,PMB5712A1,INFINEON
無線收發(fā)芯片,RF Transceiver IC,196 NSP,7.8×6.2×1.0mm,0.40 mm,N/A,RTR-8600-0-196NSP-TR-0A-0,QUALCOMM
射頻放大芯片模組,RF PA Module,Broadband PAM for Band 1,2,5,8,14 pad,3.0×4.2×0.9 mm,N/A,SKY77758,SKYWORKS
射頻放大芯片,RF PA,N/A,Small, low profile package,3*3*0.85 mm,N/A,SKY77709,SKYWORKS
射頻放大芯片,RF PA,Quad-Band GSM/EDGE,15pin,5.00×3.50×0.90mm,N/A,TQM7M5050,TRIQUINT
射頻功率放大器,RF PA,UMTS Band 4 PA,10pin,3×3×0.9 mm,N/A,ACPM-5504-TR1,AGO
射頻功率放大器,RF PA,CDMA Dual Band Power Amplifier,14pin,4×5×0.9mm,N/A,ACPM-7353-TR1,AGO
MOS FET功放模塊,MOS FET PA module,Quad-Band T×/semi-Quad R×,34pin,6.0×8.0×1 mm,With Antenna Switch,RPF89011B,RENESAS
射頻功率放大器,RF PA,TD-SCDMA 1880-1920M/2010-2025M,10pad,3.0×3.0×0.85mm,N/A,SKY77198-12,SKYWORKS
MOS FET功放模塊,MOS FET PA module,Dual band Antenna Switch,34pin,6.0×8.0×1.0(max)mm,N/A,RPF89007B,RENESAS
射頻功率放大器,RF PA,WCDMA/HSDPA/HSUPA/HSPA+/LTE,10pin,3.0×3.0×0.9 mm,LTE-Band V (824-849MHz),SKY77704,SKYWORKS
音頻放大器,Audio PA,1.42×1.42mm,9-ball WCSP,2W,class D,SN2145IY09E,SI-EN

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