高永 錫膏厚度檢測機ky8030-3 spi檢測儀

檢測不良類型                              漏印，多錫，少錫，連錫，形狀不良，偏位不良，Smear,共面性

檢測性能      

測量尺寸                              10×210mm                         0.39×20.39inch

測量高度                              400μm（2mm選項）                15.75mils(78.74mils選項)

最小焊盤間距                              100μm（150μm焊盤高度下）         3.94mils(5.91mils焊盤高度下)

PCB顏色的影響                             無如何 

PCB Handling    

軌道寬度調(diào)整                               自動

軌道固定方式                               Front/Rear Fixed(出貨時固定)

軟件   

Gerber文件格式                             GERBER Data(274x,274d)

統(tǒng)計管理工工作                             SPC Plus

                                           -Histogram,Xbar&R Chart,Xbar&S Chart,Cp&Cpk,%Gage R&R

                                           -實時SPC—Multiple Display

                                           -SPC 報警

                                           -遠距電腦自動生成報告

使用使利性                                 各零件尺寸的條件設部口生成Library

                                           停止測量功能以操作員的設定條件

操作系統(tǒng)                                    WINDOWS XP Professional/Windows7

選項     .1D—2D Hand-held barcode reader      .off-lne programming S/W(ODB++)       .Closed Loop/APC

         .1D&2D in-line barcode reader          .SPC Plus S/W                        .KSMART Warp

         .Camera Barcode Reader               .Net Monitoring S/W                 .Foreign Material Inspection

         .UPS                               .Certified Calibration Target        

*以上數(shù)據(jù)如有修改不另行通知。