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娉曟簮渚濇嵁 銆??涓崕浜烘皯鍏卞拰鍥戒俊鎭駭涓氶儴錛屼腑鍗庝漢姘戝叡鍜屽浗鍥藉鍙戝睍鍜屾敼闈╁鍛*細(xì)錛屼腑鍗庝漢姘戝叡鍜屽浗鍟嗗姟閮紝涓崕浜烘皯鍏卞拰鍥芥搗鍏蟲?緗詫紝涓崕浜烘皯鍏卞拰鍥藉浗瀹跺伐鍟嗚鏀跨鐞嗘?灞?紝涓崕浜烘皯鍏卞拰鍥藉浗瀹惰川閲忕洃鐫ｆ楠屾鐤?灞?紝涓崕浜烘皯鍏卞拰鍥藉浗瀹剁幆澧冧繚鎶ゆ?灞?仈鍚堜細(xì)絳劇殑銆婄數(shù)瀛愪俊鎭駭鍝佹薄鏌撴*鍒剁鐞嗘柟娉曘?錛堢39鍙鳳級
銆??錛圡anagement Methods for Coolling Pollution by Electronic Information Products / Ministry of Information Industry Order #39錛?/span>
閫傜敤鑼冨洿 銆??鍦ㄤ腑鍗庝漢姘戝叡鍜屽浗澧冨唴鐢熶駭銆侀攢鍞拰榪涘彛鐢?shù)瀛愪俊鎭骇鍝仒q囩▼涓*鍒跺拰鍑忓皯鐢?shù)瀛愪俊鎭骇鍝佸鐜?鎴愭薄鏌撳強(qiáng)浜х敓鍏跺畠鍏錛岄?鐢ㄦ湰鍔炴硶銆*絾鏄紝鍑哄彛浜у搧鐨勭敓浜ч櫎澶栥?
鎽樿鍐呭 銆??鐢?shù)瀛愪俊鎭骇鍝佸湪璁捐?鐢熶駭鍜岄攢鍞繃紼嬩腑搴斿綋絎﹀悎鐢?shù)瀛愪俊鎭骇鍝佹湁姣掋€佹湁瀹崇墿璐ㄦ垨鍏冪礌鎺у埗鍥藉鏍囧噯鎴栬涓氭爣鍑嗭紝鍒嗕袱闃舵鏂借錛?/span>
絎竴闃舵 銆??鎶曟斁甯傚満鐨勭數(shù)瀛愪俊鎭駭鍝佷笂搴旀爣璇嗙幆淇濅嬌鐢ㄦ湡闄愶紝鏍囪瘑鍏朵腑鍚湁鐨勬湁姣掋?鏈夊鐗╄川鎴栧厓绱犲悕縐般?鍚噺銆佹墍鍦ㄩ儴浠跺強(qiáng)鍏跺彲鍚﹀洖鏀跺埄鐢ㄧ瓑錛涚數(shù)瀛愪俊鎭駭鍝佸寘瑁呯墿涓婏紝搴旀爣娉ㄥ寘瑁呯墿鏉愭枡鍚嶇О銆傚彲鎸夌収鏍囧噯SJ/T 11363-2006銆丼J/T 11364-2006銆丼J/T 11365-2006.GB 18455-2001鐨勮姹傝繘琛屻?
絎簩闃舵 銆??榪涘叆閲嶇偣綆＄悊鐩綍錛堝埗瀹氫腑錛?鐨勪駭鍝佸繀闇?‘淇濅駭鍝佷腑鏈夋瘨鏈夊鐗╄川宸茶*夸唬錛屾垨鍚噺涓嶈秴榪囬檺閲忔爣鍑嗕笖閫氳繃寮哄埗鎬т駭鍝佽璇侊紙CCC璁よ瘉錛?/span>
銆??嬈х洘RoHS浣撶郴涓庝腑鍥絉oHS浣撶郴鍦ㄥ叿浣撴墽琛屼笂鏈変笉鍚岋細(xì)嬈х洘鍋氭硶鏄鍏堢珛娉曠姝㈢數(shù)瀛愪駭鍝佸惈鏈夊叚縐嶆湁瀹崇墿璐紝鐒跺悗鍒楀嚭涓?郴鍒楁殏鏃惰秴鏍囩殑縐嶇被錛岀瓑浠ュ悗鎶?湳鏉′歡鎴愮啛浜嗗啀縐誨嚭榪欎釜鐩綍銆*腑鍥芥槸鍙嶈繃鏉ョ殑錛氫竴鏃︽煇涓駭鍝佹妧鏈潯浠舵垚鐔熶簡灝辨斁鍏ョ洰褰曪紝鍦ㄧ洰褰曞唴鐨勪駭鍝佹槸涓嶈兘瓚呮爣鐨勩?

嬈х洘RoHS鎸囦護(hù)璞佸厤欏?/b>
銆??鐢變簬鎶?湳闂錛屾湁閮ㄥ垎鏉愭枡鎴栬?浜у搧鐨勫埗閫犳妧鏈繕鍋氫笉鍒癛OHS鎸囦護(hù)瑕佹眰錛屽湪緇忚繃鍚戞鐩熺殑鐗規(guī)畩鐢寵鍚庯紝浠ヤ笅欏圭洰鍙互鑾峰緱璞佸厤錛堥儴鍒嗚眮鍏嶆槸鏈夋湡闄愮殑錛夛細(xì) 銆??RoHS ExemptionsEU RoHS 銆??Items Exemption Clauses 銆??1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp 銆??2 Mercury in straight fluorescent lamps for general pures not exceeding: 銆??- halophosphate 10 mg 銆??- triphosphate with normal lifetime 5 mg 銆??- triphosphate with long lifetime 8 mg. 銆??3 Mercury in straight fluorescent lamps for special pures. 銆??4 Mercury in other lamps not specifically mentioned in this Annex. 銆??5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 銆??6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight. 銆??7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 銆??- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications 銆??- lead in electronic ceramic parts (e.g. piezoelectronic devices). 銆??8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations 銆??9 Hexalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 銆??10 Lead used in compliant pin connector systems 銆??11 Lead as a coating material for the thermal conduction module c-ring 銆??12 Lead and cadmium in optical and filter glass 銆??13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight 銆??14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 銆??15 DecaBDE in polymeric applications 銆??16 Lead in lead-bronze bearing shells and bulbs 銆??17 Lead in linear incandescent lamps with silicate coated tubes 銆??18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications 銆??19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) 銆??20 Lead with PbBiSn-Hg and PbInSn-Hg in specific coitions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Sing Lamps (ESL) 銆??21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD) 銆??22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass. 銆??23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems. 銆??24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames. 銆??25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 銆??26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. 銆??27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps. 銆??28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers. 銆??29 Hexalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007. 銆??30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC
銆??2009騫?鏈?1鏃ワ紝嬈х洘OJ鍒婄櫥浜?009/443/EC錛屾柊澧炰簡6欏筊oHS鎸囦護(hù)鐨勮眮鍏嶏紝鍒嗗埆濡*笅錛?/span> 銆??33. Lead insolders for the soldering of thin copper wires of 100 渭m diameter andless in power transformers. 鐢?shù)鍔涘彉鍘嬪櫒涓洿寰?00寰背鍙*互涓嬬粏閾*嚎鎵?敤鐒婃枡涓殑閾?/span> 銆??34. Lead in cermet-based trimmer potentiometer elements. 閲戝睘闄剁摲璐ㄧ殑寰皟鐢?shù)浣嶈涓殑閾?/span> 銆??35. Cadmium in photoresistors for optocouplers applied in professionalaudio equipment until 31 December 2009.2009騫?2鏈?1鏃ュ墠涓*笟闊抽璁懼鐨勫厜*﹀悎鍣ㄤ腑浣跨敤鐨勫厜鏁忕數(shù)闃葷殑闀?/span> 銆??36. Mercury used asa cathode sputtering inhibitor in DC plasma displays with a content upto 30 mg per display until 1 July 2010. 2010騫?鏈?鏃ュ墠鐩存祦絳夌瀛愭樉紺哄櫒涓槾鏋佹簠灝勬姂鍒跺墏涓殑姹烇紝鍏跺惈閲忎笉寰楄秴榪?0姣厠/鏄劇ず鍣?/span> 銆??37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. 浠ョ〖閰擱攲鐜葷拑浣*負(fù)鍩虹鐨勯珮鍘嬩簩鏋佺鐨勭數(shù)闀?眰鐨勯搮銆??38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. 鐢ㄦ哀鍖栭搷榪炴帴閾濆埗鎴愮殑鍘氳啘嫻嗘枡涓晧鍜屾哀鍖栭晧銆??姝ゅ墠錛屽湪6鏈?鏃ワ紝嬈х洘榪樺垔鐧諱簡2009/428/EC錛屼粠2011騫?鏈?鏃ヨ搗錛屽皢鍘熻眮鍏嶇殑絎?2鐐光?鍏夌氦閫氳緋葷粺紼?湡閾佺煶姒寸煶娉曟媺絎棆杞櫒涓綔涓烘潅璐ㄧ殑閾呪?浠庤眮鍏嶅垪琛ㄤ腑縐婚櫎銆?/span> 銆??鍏跺疄rohs涓?洿閮芥湁鍦ㄥ鍔犺眮鍏嶆潯渚嬨?